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Integration of Heterogeneous Thin-Films Materials and Devices：VOLUME768
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An April 2003 meeting featured 52 presentations addressing the science, engineering innovations, and applications of multi-material integration. This proceedings contains 21 papers from the meeting, reporting on recent work in heterogeneous integration and wafer bonding, and in integrated optoelectronics and layer transfer. Some specific topics include integration of porous silicon with sol-gel derived ceramic films, low temperature growth of GaAs on Si substrates for ultra-fast photoconductive switches, wafer fusion of GaSb to GaAs, and photo-polymer wafer bonding for double layer transfer. Annotation c2004 Book News, Inc., Portland, OR (booknews.com)
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